Submissions

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. We invite delegates to consider submitting abstracts that are related (but not limited) to the following topics in thermal or thermo-mechanical aspects in simulation and experiment.

If you are interested in presenting a paper or a poster at the conference, please submit an abstract of close to, but not exceeding, two pages through our online system by April 1, 2022. Our online system will open in January and the link will be posted here then.

Abstracts must be submitted in PDF format and detail the objectives of the work presented and demonstrate new results. The corresponding template will be available here shortly. All abstracts will undergo a double-blind review process. There will be best paper and best poster awards.

 

Deadlines 2022

Deadline abstract submission:
Extended to April 22, 2022

Notification of acceptance:
3rd June 2022

Submission of paper for workshop proceedings:
22nd July 2022

Topics

Thermal Phenomena in Simulation and Experiment

  • Thermal management of electronic components and systems
  • Classical and modern thermometry and thermography
  • Thermal interface materials and their characterisation
  • Thermal modelling and investigation of packages
  • Nano-scale heat transfer
  • Multi-physics simulation and field coupling
  • Electro-thermal modelling and simulation
  • CFD modelling and benchmarking
  • Advanced thermal materials and technologies
  • Numerical methods for multi-scale heat transfer

    Electronics Cooling Concepts and Applications

    • Cooling concepts: air, liquid, 2-phase, etc.
    • Power electronics
    • High temperature electronics
    • Solid state lighting / LEDs
    • Thermo-electric and sub-ambient cooling
    • Novel and advanced cooling technologies
    • Heat pipe and vapour chambers
    • 3D heterogenous integration and cooling
    • Ultra low form factor air cooling
    • Novel manufacturing methods
    • Cooling for IoT, CPS, mobile, edge computing
    • Thermal buffering for computational sprinting
    • Battery thermal management

    Thermo-mechanical Reliability

    • Thermo-mechanical reliability
    • Prognostics and health monitoring
    • Lifetime modelling and prediction
    • Damage and fracture mechanics
    • Failure analysis and inline inspection by thermal imaging