Special Section on Advances in Modelling and Characterisation for Electronics Cooling
Associate Editors: Prof Tim Persoons, Prof Lorenzo Codecasa
Manuscript submission deadline: March 1st, 2023
Publication of Special Section: August 1st, 2023
IEEE Transactions on Components, Packaging and Manufacturing Technologies (Impact Factor: 1.738)
As a follow-up to the 28th THERMINIC Workshop, held in Dublin in September 2022, a Special Section of IEEE TCPMT will be edited by Prof. Tim Persoons and Prof. Lorenzo Codecasa.
This Special Section aims to present some of the latest advances in thermal fluids and thermomechanical research for electronics cooling applications, from numerical multi-physics modelling and thermal characterisation methods to novel approaches for enhanced convective cooling, new developments in materials, and reliability assessment.
These technologies apply to an ever-wider range of target thermal management applications, including large-scale cooling of servers and cloud data storage, power electronics and batteries for electric vehicles, solid-state lighting, IoT and edge computing devices and infrastructure.
This Special Section will be inviting selected papers from the 28th THERMINIC Workshop but is also open to spontaneous submissions from any THERMINIC participant or others who want to contribute to this topic.
Some important points to note:
- Papers that were presented at THERMINIC must be revised and contain at least 60% new material that has never been presented before.
- Authors should meet IEEE TCPMT requirements for conversion of a conference paper into Transactions papers: https://eps.ieee.org/publications/ieee-transactions-on-cpmt/information-and-resources-for-authors.html.
- There is no publication fee, however the final paper is limited to 8 pages in print. Charges apply for any pages in excess of the 8-page limit (see https://journals.ieeeauthorcenter.ieee.org/your-role-in-article-production/about-potential-article-processing-charges/).
- Authors may opt for their article to be published as Open Access for an additional fee. However, several universities have agreements in place with IEEE to facilitate free Open Access rights for their employees or students.
- Use the template provided for guidance on the page count.
Links to IEEE LaTeX and Word Templates:
How to submit your article:
- Log in to https://mc.manuscriptcentral.com/ieee-tcpmt
- Click on Author > Start New Submission > Begin Submission
- In Step 1: Type, Title, & Abstract, as submission type, select Special Section’
- Proceed through the other steps.
- In Step 6: Details & Comments, enter the following in the Cover Letter section: This paper is submitted for the Special Section titled “Advances in Modelling and Characterisation for Electronics Cooling”.