Submissions

Full Paper Submission

All authors have been informed about the acceptance of their abstracts. The deadline for uploading the camera-ready full papers is August 5. The paper length for oral presenters should not exceed six pages and for poster presenters it should not exceed four pages.

Please note that we are using the standard IEEE paper template, it can be downloaded below both in docx- and in Latex-format.

The papers will be distributed in time for the conference.

Downloads

Word – Template:

Download here (.docx/30 KB)

Latex – Template :

Download here (.zip/759 KB)

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

 

Timeline

Paper upload is possible starting immediately. You will need to submit you full paper in pdf format. Please make sure to use the IEEE paper template provided on this page and to go through the IEEE Xpress pdf checker, before uploading your camera-ready paper through the conference system

    Deadlines 2022

    Deadline abstract submission:
    Extended to April 22, 2022

    Notification of acceptance:
    June 16, 2022

    Submission of paper for workshop proceedings:
    Extended to August 19, 2022

    IEEE eXpress pdf checker

    Please access the IEEE eXpress site here.
    First-time users should enter the Conference ID 57263X, their email address and a password and then continue to enter information as prompted.
    An online confirmation will be displayed and an email confirmation will be sent

    Previous users of PDF eXpress need to follow the above steps, but should enter the same password that was used for previous conferences. Verify that your contact information is valid.

    Uploading your paper in ConfTool

    While you are uploading the paper, you will also be asked to identify the presenting author and to provide a short bio of him or her.
     

      Presentation Guide for Oral Presenters
      Each presentation is scheduled for 20 minutes, please allow 5 minutes for Q&A at the end. There is no template for the presentation. Speakers are kindly asked to see the session chair 10 minutes before the session and to bring their presentation on a stick, a laptop will be provided.

      Presentation Guide for Poster Presenters
      Please bring your printed poster to the conference. The format should be A0 (84.1 x 118.9 cm, portrait style). There is no template for the poster, but please try to be simple and direct in your presentation. Use short phrases and “bulleted” text throughout and avoid long narrative paragraphs. Assistance for hanging the posters will be available. All posters should hang by lunchtime on the poster presentation day and must be picked up by Friday morning. Posters that have not been picked up will not be kept.

      Contact
      In case you experience any problems with the submission process, please contact the conference office at therminic@mcc-events.de

      Topics

      Thermal Phenomena in Simulation and Experiment

      • Thermal management of electronic components and systems
      • Classical and modern thermometry and thermography
      • Thermal interface materials and their characterisation
      • Thermal modelling and investigation of packages
      • Nano-scale heat transfer
      • Multi-physics simulation and field coupling
      • Electro-thermal modelling and simulation
      • CFD modelling and benchmarking
      • Advanced thermal materials and technologies
      • Numerical methods for multi-scale heat transfer

        Electronics Cooling Concepts and Applications

        • Cooling concepts: air, liquid, 2-phase, etc.
        • Power electronics
        • High temperature electronics
        • Solid state lighting / LEDs
        • Thermo-electric and sub-ambient cooling
        • Novel and advanced cooling technologies
        • Heat pipe and vapour chambers
        • 3D heterogenous integration and cooling
        • Ultra low form factor air cooling
        • Novel manufacturing methods
        • Cooling for IoT, CPS, mobile, edge computing
        • Thermal buffering for computational sprinting
        • Battery thermal management

        Thermo-mechanical Reliability

        • Thermo-mechanical reliability
        • Prognostics and health monitoring
        • Lifetime modelling and prediction
        • Damage and fracture mechanics
        • Failure analysis and inline inspection by thermal imaging