IEEE Transactions on Components, Packaging and Manufacturing Technology
Special issue with contributions from Therminic 2022 is recently published in IEEE Transactions on Components, Packaging and Manufacturing Technology:
The Special Issue features the following Therminic 2022 papers:
- Thermo-Electrochemical FEM and Circuit Simulations of Li-Ion Batteries, by Antonio Pio Catalano; Ciro Scognamillo; Francesco Piccirillo; Marcello Iasiello; Pierluigi Guerriero; Nicola Bianco; Lorenzo Codecasa; Vincenzo d’Alessandro
- Application of Lévêque Analogy to Open Cellular Porous Materials by Sanjeet Kumar; Sripriya Ramamoorthy; Shankar Krishnan
- Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB by Nils Jahn; Martin Pfost
- FEM Thermo-Fluid Dynamic Analysis of Advanced Metal Finned Liquid Cold Plates for High Power Semiconductor Devices and Modules by Paolo Cova; Nicola Delmonte; Davide Spaggiari; Marco Portesine; Federico Portesine; Roberto Menozzi
- Lifetime Test of Pulsewidth Modulated LEDs Supplemented With Thermal Investigations by János Hegedüs; Gusztáv Hantos; Máté Lukács; Bence Bodnár; Gyula Lipák; András Poppe
- Investigations of Mutual Thermal Couplings in Selected Lighting Sources With Power LEDs by Krzysztof Górecki; Przemysław Ptak; Marcin Janicki
- On the Fast Prediction of the Aerodynamic Performance of Electronics Cooling Fans Considering the Effect of Tip Clearance by Wenguang Zhao; Sahan Wasala; Tim Persoons
- An Experimental-Numerical Study of Heat Transfer Enhancement in a Minichannel Using Asymmetric Pulsating Flows by Parth S. Kumavat; Sajad Alimohammadi; Séamus M. O’Shaughnessy
- A Novel Approach for Cooling Chiplets in Heterogeneously Integrated 2.5-D Packages Applying Microchannel Heatsink Embedded in the Interposer by György Bognár; Gábor Takács; Péter G. Szabó
- High Heat-Flux Removal From Topside-Cooled GaN Power Devices by Water-Jet Impingement Using 3-D-Printed Nozzles by Ramgopal Varma Ramaraju; Mohammad Shawkat Zaman; Mohammad Passandideh-Fard; Olivier Trescases; Sanjeev Chandra