Special Section on Advances in Modelling and Characterisation for Electronics Cooling

Associate Editors: Prof Tim Persoons, Prof Lorenzo Codecasa

Manuscript submission deadline: March 1st, 2023

Publication of Special Section: August 1st, 2023

IEEE Transactions on Components, Packaging and Manufacturing Technologies (Impact Factor: 1.738)

As a follow-up to the 28th THERMINIC Workshop, held in Dublin in September 2022, a Special Section of IEEE TCPMT will be edited by Prof. Tim Persoons and Prof. Lorenzo Codecasa.

This Special Section aims to present some of the latest advances in thermal fluids and thermomechanical research for electronics cooling applications, from numerical multi-physics modelling and thermal characterisation methods to novel approaches for enhanced convective cooling, new developments in materials, and reliability assessment.

These technologies apply to an ever-wider range of target thermal management applications, including large-scale cooling of servers and cloud data storage, power electronics and batteries for electric vehicles, solid-state lighting, IoT and edge computing devices and infrastructure.

This Special Section will be inviting selected papers from the 28th THERMINIC Workshop but is also open to spontaneous submissions from any THERMINIC participant or others who want to contribute to this topic.

Please contact one of the editors (Prof. Tim Persoons, or Prof. Lorenzo Codecasa, if you are interested.

Some important points to note:

Links to IEEE LaTeX and Word Templates:

How to submit your article:

  1. Log in to
  2. Click on Author > Start New Submission > Begin Submission
  3. In Step 1: Type, Title, & Abstract, as submission type, select Special Section
  4. Proceed through the other steps.
  5. In Step 6: Details & Comments, enter the following in the Cover Letter section: This paper is submitted for the Special Section titled “Advances in Modelling and Characterisation for Electronics Cooling”.